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STMicroelectronics Delivers First Stellar Advanced Automotive Microcontrollers for New Road-Car Projects

STMicroelectronics (NYSE: STM), a global semiconductor leader serving
customers across the spectrum of electronics applications, has begun
delivering the first Stellar SR6 automotive microcontrollers (MCUs) for
automotive-industry leaders to realize the next generation of advanced
vehicle electronics that deliver new levels of performance and safety.

The Stellar SR6 scalable MCU family
> , targeting production
in 2024, is architected for high performing and efficient vehicle platforms.
The MCUs are particularly suited to domain and zone controllers that
simplify vehicle wiring, enable migration to software-defined platforms for
greater flexibility and richer features, and increase system reliability.

“Working with lead customers, we have successfully tested the innovations in
our game-changing Stellar SR6 MCUs and have now achieved the milestone of
supplying the first devices to new road-car projects scheduled for
production,” said Marco Monti, President, Automotive and Discrete Group,
STMicroelectronics. “These MCUs are critical enablers for tomorrow’s smart,
connected vehicles that aim to be safer, more sustainable, and deliver more
rewarding user experiences while allowing car makers and their selected
partners to strengthen customer relationships with value-added services.”

Stellar SR6 MCUs leverage ST’s robust FD-SOI process technology
> , which has excellent Soft Error Rate
(SER) immunity to ensure high system reliability and availability for ISO
26262 functional-safety applications up to ASIL-D. The devices feature
hardware-based virtualization, which allows multiple software applications
to coexist safely while preserving performance and ensuring real-time
determinism and enhances flexibility for designers by allowing multiple
independent applications or virtual Electronic Control Units (ECUs) in the
same physical MCU.

The first Stellar SR6 P and G series MCUs have up to 20Mbytes of robust
Phase-Change Memory (PCM)
?icmp=tt21791_gl_pron_jun2021> , which ensures high performance and data
retention and is compliant with AEC-Q100 Grade 0. Stellar’s innovative
dual-image storage enables efficient Over-The-Air (OTA) reprogramming with
major savings in memory size through an ST innovation that supports
configuring the PCM cell structure to double the memory size during OTA
updates, up to 2x 20MBytes. PCM access time is also faster than other
non-volatile memories such as 1T (single-transistor) NOR Flash.

The Stellar SR6 MCU family contains two series, P and G, based on the same

Stellar P Integration MCU series
>  is
designed to meet the demands of next-generation drivetrain and
electrification integration/domain systems, delivering powerful real-time
performance and determinism for superior driving experiences and safety.

Stellar G Integration MCUs
>  feature efficient
accelerators for secure data routing via CAN, LIN, and Ethernet networks and
deliver a large set of communication interfaces. With their flexible
low-power modes supporting low quiescent current and an intelligent
monitoring subsystem, Stellar G microcontrollers ensure the best overall
power efficiency.

Each is tailored for the intended domain to offer optimized and rational
solutions for next-generation vehicle needs.

Further Technical information:

The Stellar SR6 high-performance architecture meets the automotive
industry’s requirements for high performance, determinism, flexibility,
safety, and security with features including:

*       Six ArmR CortexR-R52 cores with lockstep and split/lock capabilities
ready to meet ISO 26262 ASIL-D requirements;
*       Highly efficient software separation platform for application
integration: embedded virtualization through Cortex-R52 hypervisor privilege
level, hypervisor and application Virtual Machine ID (VMID) based resource
access protection at all levels of the architecture (mainly core MPU,
network-on-chip firewalls);
*       On-chip PCM with high performance and features including single-bit
alterability that enhances performance and prevents single-bit failures,
enabling innovative approaches to application design (by unifying both NVM
and RAM features) and native support for EEPROM;
*       eMMC (embedded MultiMediaCard) and HyperbusT interfaces to external
*       Three Arm Cortex-M4 cores with floating-point arithmetic unit and
DSP extensions for application-specific acceleration and security subsystem;

*       Hardware Security Module (HSM) with full support for EVITA (E-safety
Vehicle Intrusion Protected Applications) cyber-protection architecture. The
HSMs combine with multi-bus routing to protect connectivity to
time-sensitive vehicle networks (Ethernet, CAN-FD, LIN);
*       Dedicated encryption accelerators for MACsec (Media Access Control
security protocol), IPsec (IP security protocol suite), and CAN

For more information on ST’s 32-bit Automotive Integration MCUs please go to

About STMicroelectronics
At ST, we are 46,000 creators and makers of semiconductor technologies
mastering the semiconductor supply chain with state-of-the-art manufacturing
facilities. An independent device manufacturer, we work with more than
100,000 customers and thousands of partners to design and build products,
solutions, and ecosystems that address their challenges and opportunities,
and the need to support a more sustainable world. Our technologies enable
smarter mobility, more efficient power and energy management, and the
wide-scale deployment of the Internet of Things and 5G technology. Further
information can be found at

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