AI Online


KIOXIA Introduces UFS Ver. 3.1 Embedded Flash Memory Devices for Automotive Applications

KIOXIA America, Inc. announced that it has started sampling1 new Automotive
Universal Flash Storage2 (UFS) Ver. 3.1 embedded flash memory devices. The
new lineup utilizes KIOXIA cutting-edge BiCS FLASH™ 3D flash memory and is
available in capacities from 64 gigabytes (GB) to 512GB to support the
various requirements of evolving automotive applications that elevate driver

The storage requirements for automotive applications continue to increase as
infotainment systems and ADAS3 in cars become more sophisticated. UFS is
well-suited to support the high-performance and density needs of these
applications. The new devices support a wide temperature range (-40°C to
+105°C), meet AEC4-Q100 Grade2 requirements and offer enhanced reliability
capabilities that increasingly complex automotive applications require.

The sequential read and write performance of the Automotive UFS Ver. 3.1
device is significantly improved by approximately 2.2x and 6x respectively,
over previous generation devices5. These performance gains contribute to
faster system startup and OTA (Over-the-Air) updates.

“KIOXIA continues to provide advanced flash memory solutions for automotive
with the introduction of this new UFS line-up,” noted Scott Beekman, vice
president, Memory Business Unit, for KIOXIA America, Inc. “With the
increased performance enabled by version 3.1 UFS devices tailored for
automotive, enhanced capabilities in functions, such as ADAS and
infotainment systems, can be realized.”

About KIOXIA America, Inc.

KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a
leading worldwide supplier of flash memory and solid state drives (SSDs).
From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D
technology, KIOXIA continues to pioneer innovative memory, SSD and software
solutions that enrich people’s lives and expand society’s horizons. The
company’s innovative 3D flash memory technology, BiCS FLASH, is shaping the
future of storage in high-density applications, including advanced
smartphones, PCs, SSDs, automotive, and data centers. For more information,
please visit

Previous posts

Next posts

Fri. May 24th, 2024

Share this post