Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package

Nexperia, the expert in essential semiconductors, today announced a series
of half-bridge (high side & low side) automotive MOSFETs constructed in the
space-saving LFPAK56D package format. The half-bridge configuration of two
MOSFETS is a standard building block for many automotive applications
including motor drives and DC/DC converters. The new package provides a
half-bridge solution in one device, occupying 30% lower PCB area compared to
dual MOSFETs for 3-phase motor control topologies due to the removal of PCB
tracks, whilst permitting simple automated optical inspection (AOI) during
production. The LFPAK56D half-bridge utilises existing high volume LFPAK56D
assembly processes with proven automotive reliability. The package format
uses flexible leads to improve overall reliability, and an internal copper
clip connection between the MOSFETs simplifies PCB designs and brings a plug
and play style solution with exceptional current handling capability of 98
A.

Typically, in a half-bridge arrangement, the PCB connection between the
source of the high side MOSFET and the drain of the low side MOSFET can
create a significant amount of parasitic inductance. However, with its
internal clip connection, the LFPAK56D half-bridge package achieves 60 %
less inductance.

The new LFPAK56D half-bridge MOSFETs launched are the BUK7V4R2-40H and the
BUK9V13-40H. Both utilise the highly robust Trench 9 automotive silicon
process technology, are rated at 40 V and are verified at twice the
automotive AEC-Q101 specification in key tests. RDS(on) of the devices
measures 4.2 mOhm (BUK7V4R2) and 13 mOhm (BUK9V13).

The AEC-Q101-qualified Nexperia LFPAK56D half-bridge package suits a broad
range of 3-phase automotive powertrain applications such as fuel and water
pumps, motor control and DC/DC power conversion, occupying 30% lower PCB
area and 60% lower parasitic inductance for high performance switching
applications. The new technology has already seen success with design-in and
commitment from major automotive customers.

For more information, including product datasheets and quick learning
videos, visit www.nexperia.com/lfpak56d-half-bridge

About Nexperia
Nexperia is a leading expert in the high-volume production of essential
semiconductors, components that are required by every electronic design in
the world. The company’s extensive portfolio includes diodes, bipolar
transistors, ESD protection devices, MOSFETs, GaN FETs and analog & logic
ICs. Headquartered in Nijmegen, the Netherlands, Nexperia annually ships
more than 90 billion products, meeting the stringent standards set by the
automotive industry. These products are recognized as benchmarks in
efficiency – in process, size, power and performance – with industry-leading
small packages that save valuable energy and space.

With decades of experience in supplying to the world’s leading companies,
Nexperia has over 12,000 employees across Asia, Europe and the US. Nexperia,
a subsidiary of Wingtech Technology Co., Ltd. (600745.SS), has an extensive
IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001 and OHSAS
18001.