Endicott Interconnect Technologies, Inc. (EI) announced that the Company has been awarded a $39.5M research & development contract modification by the U.S. Department of Defense for phase 2 development of electronic packaging
technologies including printed circuit boards and organic substrates for a next generation super computer application.
This contract, originally announced in December, 2008, supports the exploration and
development of advanced, high speed, electronic packaging technologies; specifically system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
“Development of these future technologies is progressing well and we continue to
actively recruit engineers across multiple disciplines in our efforts to develop the next generation of scientists and engineering personnel to support our customer’s needs,” stated Rajinder Rai, VP of EI’s Microelectronics Division.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success.
With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.